Solder pad for printed circuit boards

Details Solder pad for printed circuit boards Solder pad for printed circuit boards

H - Electricity

05

K

H05K 1/02 (2006.01) H05K 1/11 (2006.01) H05K 3/32 (2006.01) H05K 3/34 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2195314

An omni-directional non-occluding solder pad (40) design for printed circuit boards (10) comprising a plurality of spokes (42) radiating outward from a through-hole (16) on the printed circuit board (10), with a ring (44) concentric to the through-hole that intersects each of the plurality of spokes at approximately a perpendicular angle. The ringed-spoke configuration eliminates the need to ensure proper orientation of the solder pad (40) on the printed circuit board (10) prior to a wave soldering process since the symmetrical ringed-spoke design is omni-directional. The concentric ring structure provides an additional contact area of solder between the printed circuit board and a computer chassis (12). This additional contact area of solder ensures that there is sufficient electical connection between the printed circuit board (10) and the computer chassis (12) such that when the printed circuit board (10) is mounted to the computer chassis (12), a proper grounding connection is provided.

Configuration de pastille (40) de brasage non obturante ominidirectionnelle destinée à des plaquettes (10) de circuits imprimés, cette configuration comprenant une pluralité de bras (42) rayonnant vers l'extérieur depuis un trou traversant (16) formé sur la plaquette (10) de circuits imprimés, un anneau (44) concentrique par rapport au trou traversant entrecoupant chacun des bras approximativement à un angle perpendiculaire. Grâce à cette configuration à bras rayonnants et anneau, il devient inutile de s'assurer que la pastille de brasage est bien orientée sur la plaquette (10) de circuits imprimés avant d'effectuer le procédé de brasage tendre à la vague, étant donné que la configuration à anneaux symétriques et à bras est omnidirectionnelle. La structure annulaire concentrique produit une surface de contact supplémentaire de brasage entre la plaquette de circuits imprimés et un boîtier (12) d'ordinateur. Cette surface de contact supplémentaire de brasage assure qu'il existe suffisamment de connexions électriques entre la plaquette (10) de circuits imprimés et le boîtier (12) d'ordinateur de sorte que, lorsque la plaquette (10) de circuits imprimés est montée sur le boîtier (12) d'ordinateur, il s'établit une connexion à la masse appropriée.

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