B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 35/365 (2006.01) B23K 35/02 (2006.01) B23K 35/36 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2156466
Solder pastes presently harden or congeal over time. This results in wasted solder paste and in production down time. This hardening is a result of the long polymer chains created by the dicarboxylic acid in the activator and the indium (In) or tin (Sn). A solder paste is described in which the metal alloy is coated by an agent that inhibits the reaction with the dicarboxylic acid. One solution involves coating the metal alloy powder with monocarboxylic acids, which truncate the polymer chain. Another manner for truncating the polymer is to coat the metal alloy powder with complexing agents. The metal alloy powder can also be coated by a stable metal such as lead (Pb), gold (Au), silver (Ag), bismuth (Bi), palladium (pd), platinum (Pt), a silver palladium alloy (AgPd) or a silver platinum alloy (AgPt).
Bratschun William Rudolph
Leicht John Laurence
Wrezel James Alan
Gowling Lafleur Henderson Llp
Motorola Inc.
LandOfFree
Solder paste and method for producing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder paste and method for producing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder paste and method for producing will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1937659