Solder paste application to circuit boards

Details Solder paste application to circuit boards Solder paste application to circuit boards

B - Operations, Transporting

05

D

356/22, 356/6, 1

B05D 1/28 (2006.01) B05C 1/02 (2006.01)

Patent

CA 1258011

SOLDER PASTE APPLICATION TO CIRCUIT BOARDS Abstract of the Disclosure Solder paste is applied to circuit boards, in predetermined amounts at predetermined positions by providing a plurality of holes in d plate, the holes in a predetermined pattern, filling solder paste into the holes when in an upward facing direction, pivotting the plate over the circuit board, and ejecting the solder paste onto a circuit board. Conveniently the solder paste is ejected by pins mounted on a further plate and reciprocated in the holes. The position of the pins in the holes during filling, and the size of the holes, determines the amount of solder paste filled into the holes. - i -

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