Solder preform

Details Solder preform Solder preform

B - Operations, Transporting

23

K

113/86

B23K 35/02 (2006.01) B23K 35/26 (2006.01) H01L 21/50 (2006.01)

Patent

CA 1099994

SOLDER PREFORM ABSTRACT OF THE DISCLOSURE A solder preform for hermetically sealing a cover to a container for a semiconductor package comprises a relatively thick Mat ring of an alloy comsisting of substantially 63% tin and 37% lead and having a characteristic that it solidifies from the fluid state as a homogeneous mixture. The solder preform has a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of substantially 96.5% tin and 3.5% silver. The thickness of the ring is of the order of 0.0018 inch and the thick- ness of the alloy coaling is of the order of 0.0001 inch.

335561

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