Solder preform for use in hermetically sealing a container

Details Solder preform for use in hermetically sealing a container Solder preform for use in hermetically sealing a container

B - Operations, Transporting

23

K

13/7

B23K 35/26 (2006.01) B23K 35/02 (2006.01) H01L 21/50 (2006.01) H01L 23/10 (2006.01)

Patent

CA 1041710

SOLDER PREFORM FOR USE IN HERMETICALLY SEALING A CONTAINER ABSTRACT OF THE DISCLOSURE A solder preform for hermetically sealing a cover to a container for a semiconductor package comprises a relatively thick flat ring of an alloy consisting of substantially 95% lead, 2.5% tin, and 2.5% silver, which alloy has the characteristic that it solidifies from the fluid state as a homogeneous mixture without substantial separation of the minority element crystals. The solder preform further comprises a relatively thin coating clad on each surface of the flat ring of an oxidation-resistant alloy, preferably an alloy consisting of substantially 96.5% tin and 3.5% silver.

260194

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