B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
113/93
B23K 3/00 (2006.01) B23K 3/08 (2006.01)
Patent
CA 1090199
ABSTRACT IMPROVEMENT ON TINNED COPPER BRAIDS FOR SOLDER REMOVING A device for removing a solder alloy from a solid soldered joint comprising a multiplicity of met- allic strands formed into an elongated wick operable to effect the solder removal through the application of an end portion thereof to the joint in heat exchange relation to a heat source so that when the solder alloy is rendered molten by the heat source it will flow by capillary action from the joint into the applied end portion of the wick, the improved step of each metallic strand of the wick having its exterior surface coated with solidified solder alloy having a melting point substantially below the melting point of tin prior to being formed into the wick so that when the end portion thereof is applied to the joint in heat exchange rela- tion with the heat source as aforesaid the solid solder alloy of the coating on the strands of the applied end portion when rendered molten by the heat source mixes with the molten solder alloy from the joint flowing by capillary action into the applied end portion of the wick, and an improved wick formed by the method.
315700
Goudreau Gage & Associates
Spirig Ernst
LandOfFree
Solder removing wick does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder removing wick, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder removing wick will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-482259