Solder resist paste and method of soldering

Details Solder resist paste and method of soldering Solder resist paste and method of soldering

C - Chemistry, Metallurgy

08

K

6/6, 113/89

C08K 5/05 (2006.01) B23K 1/20 (2006.01) B23K 31/02 (2006.01) C08K 13/02 (2006.01)

Patent

CA 1227908

SOLDER RESIST PASTE AND METHOD OF SOLDERING Abstract of the Disclosure A solder resist paste having the feature that it is relatively easily removed is disclosed. The paste is comprised of a liquid polyglycol (e.g. Pluronic* 25R2 by BASF) and either Kaolin or talc powder. In operation, the paste is selectively applied to holes in the PCB which it is desired to keep open during a soldering process. The paste is then washed out of the holes, additional components mounted via those holes, and soldered into place. - i -

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