H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2273662
There is disclosed herein an electronic circuit assembly, such as a printed circuit board, having solder resist windows with one or more enlarged solder resist pullback zones, thereby facilitating solder paste overprinting. -19-
Jairazbhoy Vivek
Mcmillan Richard
Ford Motor Company
Ford Motor Company Of Canada Limited
Sim & Mcburney
LandOfFree
Solder resist window configurations for solder paste... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder resist window configurations for solder paste..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder resist window configurations for solder paste... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1796385