Solder shaping process using a light source

Details Solder shaping process using a light source Solder shaping process using a light source

B - Operations, Transporting

23

K

B23K 1/00 (2006.01) B23K 1/005 (2006.01)

Patent

CA 2354546

A process for treating the surface of solid fusible solder supported on a substrate, comprises a light beam as a source of power and a tool having a treatment surface with a selected shape. The light source is aimed at the fusible material and activated until the solder is fused then the tool is brought into contact with the solder to reshape the surface of the solder. The solder is allowed to cool to permit re-solidification, then the tool is withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material that is not wettable by the solder. Stops may be utilized for limiting movement between the tool and the substrate to a specified gap for the treatment surface.

Affiliated with

Also associated with

Rating

Solder shaping process using a light source does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder shaping process using a light source, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder shaping process using a light source will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1402800