Solder stripping solution

Details Solder stripping solution Solder stripping solution

C - Chemistry, Metallurgy

09

K

149/19

C09K 13/06 (2006.01) C09K 13/08 (2006.01) C23F 1/44 (2006.01) H05K 3/06 (2006.01)

Patent

CA 1203149

SOLDER STRIPPING SOLUTION Abstract of the Disclosure Solder stripping solution having an extended life for stripping and removing tin-lead alloy solder or tin deposits from entire circuits or tabs with an insignificant amount of attack on the base epoxy laminate or underlay copper or nickel substrate while leaving a residue-free substrate surface. This solu- tion can be utilized at room temperature or preferably slightly above, and has a prolonged useful life of weeks to months. The composition of the solution includes a hydroxyphenol in an aqueous solution of a nitro- substituted aromatic compound, an inorganic acid, and thiourea.

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