Solder system and method of using same with alignment monitor

Details Solder system and method of using same with alignment monitor Solder system and method of using same with alignment monitor

H - Electricity

05

K

356/1, 356/22

H05K 13/04 (2006.01) H01R 43/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1295424

SOLDER SYSTEM AND METHOD OF USING SAME Abstract of the Disclosure A solder system is adapted for use in soldering the terminals of a plurality of circuit boards, to corresponding leads of a plurality of cables. The solder system includes a holding mixture for supporting adjustably the circuit boards relative to the corresponding cables. A gripper assembly retains the cable leads in position above the corresponding board terminals. A monitor assembly is utilized to supervise optically the various stages of the soldering process. A heater assembly is mounted adjustably above the holding fixture for reflowing the solder material over the aligned cable leads and board terminals. <18118-01.209>

578421

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