Solderable aluminum-based material

Details Solderable aluminum-based material Solderable aluminum-based material

C - Chemistry, Metallurgy

23

F

C23F 11/00 (2006.01) B23K 35/22 (2006.01) B23K 31/12 (2006.01)

Patent

CA 2630501

The present invention discloses a solderable aluminum-based material, wherein electron donors combine with the non-bonded atoms on the surface of an aluminum-based material. The bonding between the electron donors and the aluminum atoms on the surface generates a protective film to prevent from the formation of an aluminum oxide layer on the surface of the aluminum-based material. The present invention improves the conventional aluminum-based material, and has lightweightness, a low price, a high economic value, a high electric conductivity, a high thermal conductivity and a superior solderability. Thereby, a normal soldering, a total-face soldering or a double-side soldering can be easily performed on the solderable aluminum-based material of the present invention with a common soldering technology.

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