Solderable conductive compositions having high adhesive...

Details Solderable conductive compositions having high adhesive... Solderable conductive compositions having high adhesive...

H - Electricity

01

B

31/156, 400/4202

H01B 1/22 (2006.01) C08K 3/08 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1246767

- 1 - Patent Application of Frank St. John and Samson Shahbazi for SOLDERABLE CONDUCTIVE COMPOSTIONS HAVING HIGH ADHESIVE STRENGTH ABSTRACT OF THE DISCLOSURE This invention provides conductive compositions that are directly solderable and that can be bonded directly to substrates. The compositions are made of silver exclusively in the form of flake and a resin system, said rosin system comprising phenolic rosin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardener. By making a mixture of such a complex vehicle system a composition is produced that displays outstanding solderability and adhesion. Also provided is a method of making these compositions.

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