H - Electricity – 01 – B
Patent
H - Electricity
01
B
117/189, 117/198
H01B 1/22 (2006.01) C08K 3/08 (2006.01) C08K 9/04 (2006.01) C09D 5/24 (2006.01) H05K 1/09 (2006.01)
Patent
CA 1286439
PATENT APPLICATION OF Frank St. John F. Wayne Martin for SOLDERABLE POLYMER THICK FILMS DN-84-001 WERS:day ABSTRACT OF THE DISCLOSURE This invention discloses conductive compositions having improved solderability. These compositions contain metal and/or alloys thereof coated with saturated monocarboxylic acid which is dispersed in an organic polymeric matrix. Also disclosed is a method for preparing these conductive compositions. Another embodiment of the invention is a method of coating metal and/or alloys thereof with carboxylic acid.
480988
Martin Frank W.
St. John Frank
Electro Materials Corp. Of America
Gowling Lafleur Henderson Llp
Martin Frank W.
St. John Frank
LandOfFree
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