H - Electricity
05
K
H05K 3/00 (2006.01) B23K 1/008 (2006.01) B23K 1/08 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2079306
91B133/MW ABSTRACT SOLDERING A soldering apparatus 20 includes a conveyor 22 adapted to carry assembled circuit boards through a soldering chamber 24. A wave 26 of solder is created in the chamber 24. The chamber 24 has a curtain 40 at its entrance 21 and a curtain 41 at its exit 23. Gas distributors 32 and 34 are located within the chamber 24 and are able to introduce nitrogen into the chamber 24 in order to create a non-oxidising atmosphere in the vicinity of the wave. In operation, the wave 26 of solder wets connecting points between the components and the board to form permanent joints on solidification of the solder. The bottom edge of the curtain is of a shape complementary to the front elevation of the assembled circuit boards to be soldered and is arranged such that the circuit boards just pass thereunder without making contact with it.
Precious Colin John
Thomas Raymund
Gowling Lafleur Henderson Llp
The Boc Group Plc
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