C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
75/89, 113/91
C22C 11/00 (2006.01) B23K 35/26 (2006.01)
Patent
CA 1057536
ABSTRACT OF THE DISCLOSURE A soldering alloy comprises: - 65 to 85% lead by weight - 12 to 30% cadmium by weight - 1 to 6% antimony by weight, and optionally - 0 5 to 1% tin by weight. In a method for soldering metal parts at least some of which are aluminum, the parts are heated with an organic flux on the portions thereof to be connected together, said portions are coated with the above mentioned soldering alloy, and then they are heated to the liquidus temperature of the soldering alloy while being held together in contact.
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