Soldering alloy for soldering contact materials

Details Soldering alloy for soldering contact materials Soldering alloy for soldering contact materials

C - Chemistry, Metallurgy

22

C

306/355, 75/74

C22C 5/08 (2006.01) B23K 35/30 (2006.01)

Patent

CA 1218882

ABSTRACT OF THE DISCLOSURE For directly soldering oxide-containing silver contact materials onto supports soldering alloys containing 20 to 35% by weight of copper and 0.1 to 5% by weight of palladium in addition to silver are used. The soldered joints produced with these solders show an increased service life of the junk- tion zones in switching tests.

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