Soldering apparatus

Details Soldering apparatus Soldering apparatus

B - Operations, Transporting

23

K

327/84

B23K 3/06 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1302519

ABSTRACT "Soldering Apparatus" Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (1,2) for guiding the carrier across the solder bath, and means for urging the carrier along the tracks. The track has a first profiled region (12,19) for guiding a leading portion of the carrier down towards the surface of the solder, and a second profiled region (16,20) longitudinally spaced from the first region, and laterially offset, for simultaneously guiding a trailing portion of the carrier down towards the surface of the solder, the profiles being substantially the same so that the carrier maintains its horizontal orientation whilst being moved vertically towards and away from the surface of the solder. The carrier moves on follower wheels which run along the tracks.

541785

Affiliated with

Also associated with

Rating

Soldering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1284502