Soldering apparatus

Details Soldering apparatus Soldering apparatus

B - Operations, Transporting

23

K

113/89, 26/90

B23K 3/06 (2006.01)

Patent

CA 1190095

SOLDERING APPARATUS Abstract of the Disclosure A soldering apparatus for soldering electronic elements without lead wires to a printed circuit board provides two first solder waves and a second solder wave discharged respectively from a first nozzle and a second nozzle connected to first and second independent tanks. The printed circuit board is moved so that its lower surface is sequentially brought into contact with the first and second waves.

389728

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