H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/22
H05K 3/34 (2006.01) B23K 3/06 (2006.01)
Patent
CA 1193753
SOLDERING APPARATUS FOR PRINTED CIRCUIT BOARD Abstract of the Disclosure An improved soldering apparatus for printed circuit boards includes a first solder tank and a second solder tank provided adjacent each other for storing molten solder. A first nozzle and a second nozzle independent of each other are disposed in the first and second tanks, respectively, and serve to spout molten solder. A printed circuit board is passed sequentially and at an upward incline through solder waves from the first and second nozzles. The arrangement is characterized in that the second nozzle is disposed at a level above that of the first nozzle, the level of the molten solder in the second tank also being disposed higher than that in the first tank. The arrangement provides improved soldering and enables ready adjustment of the optimum spouting heights.
401662
Matsuda Chuichi
Murakami Shuichi
Wakahata Tamotsu
Kirby Eades Gale Baker
Matsushita Electric Industrial Co. Ltd.
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