Soldering composition

Details Soldering composition Soldering composition

B - Operations, Transporting

23

K

75/78, 113/86

B23K 35/24 (2006.01) B23K 35/28 (2006.01)

Patent

CA 1165647

Abstract of the Disclosure A zinc-based composition comprising from 0.01 to 5 percent lead and 0.01 to 20 percent tin, preferably minor amounts of chromium and/or titanium and/or nickel and with the balance being zinc is provided. A minor amount of copper may also be present. The composition is particularly useful for joining copper and copper alloys because it will wet and readily flow on the copper or copper alloy surfaces. It also has reduced dissolving action on the copper and copper alloys due to its reduced reactivity with them. It also has improved conductivity vis-a-vis conventional lead-tin and lead-tin-silver solders.

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