Soldering compositions, fluxes and methods of use

Details Soldering compositions, fluxes and methods of use Soldering compositions, fluxes and methods of use

C - Chemistry, Metallurgy

22

C

75/77, 148/62.1

C22C 18/02 (2006.01) B23K 35/28 (2006.01) B23K 35/36 (2006.01)

Patent

CA 1245475

Abstract: A zinc-based composition comprising, by weight: from about 0.1 to about 4 percent copper; from about 0.1 to about 1 percent nickel; from about 0.01 to less than 0.5 percent alum- inum; 0 to about 0.5 percent chromium; 0 to about 0.5 percent titanium; and the re- mainder being zinc is provided. The composition is useful for coating or joining metal surfaces, par- ticularly metals formed of or containing copper. The above composition may be used with or with- out a flux. Particularly beneficial results are obtained when a flux having a composition compris- ing, by weight: from about 5 to about 70 percent ZnC12; from about 1 to about 28 percent NH4Cl; from about 0.1 to about 10 percent SnC12; from about 0 to about 10 percent HCl; from about 0 to about 10 percent Li2B4O7; from about 0 to about 5 percent MgBr2; from about 0 to about 5 percent ZnBr2; and about 0 to about 94 percent water is used.

484135

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