Soldering flux

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 35/363 (2006.01) B23K 35/36 (2006.01) H05K 3/34 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2393399

A soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board.

L'invention concerne un flux décapant comprenant une résine non acidique dans une composition aqueuse. Le flux peut également comprendre un agent activant et un agent de surface actif favorisant le mouillage de surface. Le flux peut également être utilisé pour recouvrir des circuits et une carte à circuit imprimé.

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