Soldering flux and method

Details Soldering flux and method Soldering flux and method

B - Operations, Transporting

23

K

113/89

B23K 1/02 (1980.01)

Patent

CA 1045907

ABSTRACT OF THE DISCLOSURE A method and composition for mass fluxing a perforated circuit board prior to soldering electrical and electronic components to the board. The flux composition comprises a flux material, a carrier for the flux material, and a meltable cement for temporarily supporting said components in position on said board. The flux carrier and the meltable cement con- sist of the same material, which material is compatible with the flux material and is capable of forming a solid matrix in which said components and said board may be retained in a fixed relationship. The flux composition is mass applied to the board in a convention manner.

293934

Affiliated with

Also associated with

Rating

Soldering flux and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering flux and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering flux and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-236610