Soldering flux vehicle additive

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 35/36 (2006.01) C08K 5/05 (2006.01) C08K 5/09 (2006.01) C08K 5/10 (2006.01) H05K 3/12 (2006.01) H05K 3/34 (2006.01) B23K 35/02 (2006.01)

Patent

CA 2449849

A solder paste formulation which comprises a solder paste powder and a non- aqueous vehicle, characterized in that the vehicle includes therein at least one lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof. The solder pastes have an improved release from a stencil during printing and thus are adapted for use in fine pitch stencil printing.

L'invention concerne une formulation de pâte à souder comprenant une poudre de pâte à souder ainsi qu'un véhicule non-aqueux, caractérisée en ce que ledit véhicule comporte au moins un additif lubrifiant qui est un acide gras ou un alcool gras à chaîne ramifiée comprenant entre 8 et 50 atomes de carbone dont 4 au moins font partie de la chaîne alkyle plus courte, ou un ester dudit composé. La pâte à souder selon l'invention se détache plus facilement du pochoir au cours de l'impression et est ainsi conçue pour être utilisée dans le cadre d'une impression par pochoir à pas fin.

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