B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
113/94
B23K 3/02 (2006.01) H01R 43/02 (2006.01)
Patent
CA 1046861
ABSTRACT OF THE DISCLOSURE This invention relates to soldering irons, particularly to soldering irons for soldering wires into a multicore connec- tor. According to the prior art, each wire is hand soldered into corresponding metal lined channels in the connector. The wire coverings are stripped individually, and the wires are applied and soldered individually with a conventional soldering iron to a metal liner in the connector. In another method, solder is applied to the wires and to the metal lines. The wires are then inserted into the metal liners and each wire is soldered individually to its encompassing liner by melting the previously applied solder with a conventional soldering iron. Recently, a wire positioning device has been developed which automatically cuts, strips, and positions the wires in their metal liners. However, each wire must still be individually hand soldered. The present invention provides a soldering iron in the form of a heat conducting plate having a plurality of projections at one end. The projections are spaced to corres- pond to the spacing of the metal liners in the connector. The sides of each projection converge towards its tip and are plated to resist oxidation and to be easily wetted by the solder. The tips of the projections can be positioned within the channels in the connector with their converging sides contacting respec- tive edges of the metal liner. In such position, heat can be conducted by the iron to solder wires positioned in the metal liners.
218240
Oda Shizuo
Sato Shoichi
LandOfFree
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