Soldering method for electric and/or electronic components

Details Soldering method for electric and/or electronic components Soldering method for electric and/or electronic components

H - Electricity

05

K

356/1

H05K 3/34 (2006.01) B23K 3/06 (2006.01)

Patent

CA 1159575

TITLE OF THE INVENTION A SOLDERING METHOD FOR ELECTRIC AND OR ELECTRONIC COMPONENTS ABSTRACT OF DISCLOSURE A soldering method comprises forming bubbles a pool of molten solder, the bubbles rapidly rising toward the top of the molten solder and striking the bubbles against a printed circuit board and electric and or electronic components temporarily fixed thereto to solder them to each other.

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