B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
356/8, 327/84
B23K 31/02 (2006.01) H05K 3/34 (2006.01) H05K 7/02 (2006.01) H05K 3/42 (2006.01)
Patent
CA 1277776
SOLDERING PINS INTO PRINTED CIRCUIT BOARDS Abstract of the disclosure Soldering splined pins into holes in printed circuit boards by providing small volumetric gaps between the splines to allow thin layers of solder lining, the holes to be sufficiently thick to block the gaps during solder flow. The solder may have a maximum thickness of 0.001 inches to block the gaps unassisted by additional solder.
557463
Austin Reginald J.
Kubis Leon S.
Northern Telecom Limited
LandOfFree
Soldering pins into printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Soldering pins into printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering pins into printed circuit boards will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1257072