Soldering tip having a surface with a lattice structure

Details Soldering tip having a surface with a lattice structure Soldering tip having a surface with a lattice structure

B - Operations, Transporting

23

K

B23K 3/02 (2006.01)

Patent

CA 2677729

The invention relates to a soldering tip (1) for a soldering device, which comprises a heat generating or heat conducting base body (4), and which on the outside thereof has a contact surface (11) that can be wetted by solder (12) at least in sections, wherein the material of the contact surface (11) has a grid structure. The soldering tip (1) according to the invention further encompasses the incorporation of charged elementary particles of at least one foreign material into the grid structure of the contact surface (11).

L'invention concerne une panne (1) pour un dispositif de brasage, comprenant un corps de base (4) générant ou conduisant de la chaleur, et présentant une face supérieure de brasage (11) apte à être recouverte au moins partiellement sur sa face externe par de l'étain de brasage (12), le matériau de la face supérieure de contact (11) présentant une structure en grille (11). Selon l'invention, des particules élémentaires chargées d'un matériau étranger sont introduites dans la structure en grille de la surface de contact (11) de la panne.

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