Solderless, pushdown connectors for rf and dc

Details Solderless, pushdown connectors for rf and dc Solderless, pushdown connectors for rf and dc

H - Electricity

01

R

339/105

H01R 13/514 (2006.01) H01R 11/26 (2006.01) H05K 1/02 (2006.01) H05K 3/36 (2006.01)

Patent

CA 1300708

Abstract Solderless, Pushdown Connector for RF and DC A connector arrangement (13) for electrically connecting first and second microstrip structures (15,15') carrying for example RF and DC voltage values therebetween, the groundplates of the connector arrangement (13) and said microstrip structures (15,15') establishing an offset stripline arrangement, the dielectric layer of the connector arrangement (13) being substantially thicker and the dielectric constant thereof substantially lower in value than the corresponding values of the dielectric layers of said microstrip structures (15,15'), thereby enabling the metalization lines (18, 20 and 21) in the connector arrangement (13) to be relatively wide to enable effective alignment of microstrip structures (15,15') and connector arrangement (13).

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