Solid bi-layer structures for use with high viscosity inks...

Details Solid bi-layer structures for use with high viscosity inks... Solid bi-layer structures for use with high viscosity inks...

B - Operations, Transporting

41

J

B41J 2/045 (2006.01) B41J 2/04 (2006.01) B41J 2/14 (2006.01)

Patent

CA 2289860

Low acoustic solid wave attenuation structures are formed with an electroformed nickel mold, and are incorporated within acoustic ink emitters, between the focusing lens and surface of an ink layer. The structures have characteristics of low attenuation of acoustic waves to increase the efficiency of acoustic wave transmission within the acoustic ink emitter. Using the described structures, acoustic ink printers can accurately emit materials having high viscosity, including hot melt inks.

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