Solid-state lighting device package

Details Solid-state lighting device package Solid-state lighting device package

H - Electricity

01

L

H01L 23/34 (2006.01) F21V 13/04 (2006.01) H01L 23/02 (2006.01) H01L 25/075 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2613974

The present invention provides a lighting device package, which can provide a means for efficient thermal access to the lighting device package in addition to a desired level of light extraction from the one or more light-emitting elements within the lighting device package. The lighting device package comprises a substrate having a thermally conductive region to which one or more light-emitting elements are thermally connected, wherein the light- emitting elements may be relatively closely packed. An optical system is optically coupled to one or more light emitting elements, and is positioned relative to the substrate such that the optical system substantially encloses the one or more light-emitting elements on the substrate. The optical system is adapted to extract the light from the one or more light-emitting elements.

La présente invention décrit un emballage pour dispositif d'éclairage offrant un accès thermique efficace ainsi qu'un niveau souhaité d'extraction de lumière d'un ou de plusieurs éléments électroluminescents situés à l~intérieur de l~emballage pour dispositif d'éclairage. L~emballage pour dispositif d'éclairage comprend un substrat ayant une région thermiquement conductrice à laquelle un ou plusieurs éléments électroluminescents sont thermiquement reliés, les éléments électroluminescents pouvant être emballés de manière relativement proche. Un système optique est relié optiquement à un ou plusieurs éléments électroluminescents et est placé relativement au substrat, de façon à englober sensiblement le ou les éléments électroluminescents sur le substrat. Le système optique permet d'extraire la lumière d'un ou de plusieurs éléments électroluminescents.

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