Solid thermally expansible material

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 59/20 (2006.01) C08L 63/00 (2006.01)

Patent

CA 2613762

A solid thermally expansible material is provided. The material includes a solid epoxy resin that is substantially free of liquid epoxy resin and semi- solid epoxy resin. The material also includes an impact modifier, a curing agent and a heat-activated foaming agent. The impact modifier includes rubber in one embodiment and is substantially free of rubber in another embodiment. Following heat activation, the material expands and can adhere to a substrate. A cured expanded reinforcement material is also provided, as is a method of reinforcing a substrate.

L'invention concerne un matériau solide thermo-expansible, qui comprend une résine époxyde solide sensiblement exempte de résine époxyde liquide et de résine époxyde semi-solide. Le matériau comprend également un antichoc, un agent de cuisson et un agent d'expansion sensible à la chaleur. L'antichoc comprend un caoutchouc dans un mode de réalisation, et est sensiblement exempt de caoutchouc dans un autre mode de réalisation. Après activation à chaud, le matériau se dilate et peut adhérer à un substrat. L'invention concerne également un matériau de renfort dilaté polymérisé, ainsi qu'un procédé de renforcement d'un substrat.

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