C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/20 (2006.01) C08L 63/00 (2006.01)
Patent
CA 2613762
A solid thermally expansible material is provided. The material includes a solid epoxy resin that is substantially free of liquid epoxy resin and semi- solid epoxy resin. The material also includes an impact modifier, a curing agent and a heat-activated foaming agent. The impact modifier includes rubber in one embodiment and is substantially free of rubber in another embodiment. Following heat activation, the material expands and can adhere to a substrate. A cured expanded reinforcement material is also provided, as is a method of reinforcing a substrate.
L'invention concerne un matériau solide thermo-expansible, qui comprend une résine époxyde solide sensiblement exempte de résine époxyde liquide et de résine époxyde semi-solide. Le matériau comprend également un antichoc, un agent de cuisson et un agent d'expansion sensible à la chaleur. L'antichoc comprend un caoutchouc dans un mode de réalisation, et est sensiblement exempt de caoutchouc dans un autre mode de réalisation. Après activation à chaud, le matériau se dilate et peut adhérer à un substrat. L'invention concerne également un matériau de renfort dilaté polymérisé, ainsi qu'un procédé de renforcement d'un substrat.
Blank Norman
Finter Juergen
Hoefflin Frank
Kow Cheong
Rosenberg Steven
Gowling Lafleur Henderson Llp
Sika Technology Ag
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