Solution for preliminary treatment of polyimide

Details Solution for preliminary treatment of polyimide Solution for preliminary treatment of polyimide

C - Chemistry, Metallurgy

09

D

204/18, 6/4, 117

C09D 5/38 (2006.01) C23C 18/20 (2006.01) C23C 18/22 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1234254

A B S T R A C T The invention relates to an aqueous solution for pretreatment of polyimide containing an alkali hydroxide possibly mixed with an organic nitrogen com- pound to increase the adhesion of metal layers deposited chemically or possibly by electro-plating processes after subsequent activation, characterised by the fact that the solution additionally contains a bivalent metal in the form of its compounds.

460364

Affiliated with

Also associated with

Rating

Solution for preliminary treatment of polyimide does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solution for preliminary treatment of polyimide, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solution for preliminary treatment of polyimide will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1174993