Solution for preliminary treatment of polyimide

C - Chemistry – Metallurgy – 09 – D

Patent

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204/18, 6/4, 117

C09D 5/38 (2006.01) C23C 18/20 (2006.01) C23C 18/22 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1234254

A B S T R A C T The invention relates to an aqueous solution for pretreatment of polyimide containing an alkali hydroxide possibly mixed with an organic nitrogen com- pound to increase the adhesion of metal layers deposited chemically or possibly by electro-plating processes after subsequent activation, characterised by the fact that the solution additionally contains a bivalent metal in the form of its compounds.

460364

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