C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
6/2
C23C 22/00 (2006.01) C23C 18/42 (2006.01) C23C 18/44 (2006.01) C23C 22/68 (2006.01) C23C 22/82 (2006.01) C23F 3/00 (2006.01) C23F 3/04 (2006.01)
Patent
CA 1300318
ABSTRACT OF THE DISCLOSURE Non-toxic solutions are provided to silver plate metallic items and previously silver plated items. Solutions and creams are also provided which simultaneously silver plate and polish such items. The amount of silver generating compound is selected to either maintain or replenish the amount of silver plating on the items. Solutions are also provided to prevent staining during the silver plating and polishing. The elements of the water based solution or cream are selected from silver salts comprising silver nitrate, silver oxide, silver chloride, silver carbonate and silver phosphate, with silver nitrate being preferred. A reducing compound is selected from the group comprising potassium hydrogen tartrate, sodium sulfite and sodium metabisulfate. A surfactant is selected from a variety of polyoxyalkylene ester compounds such as commercially available polyoxyethylene sorbitan patty esters. A humectant is selected from the group of diethylene glycol, dipropylene glycol and triethylene glycol and serves as a wetting agent. A diatomaceous earth such as Kieselguhr may be used to prevent precipitation from the solution. In the creams: silver acetate and silver lactate may also be used although silver nitrate is preferred: sodium thiosulfate may also be used as the reducing compound although potassium hydrogen tartrate is preferred; and alcohols are used as emulsifiers.
548241
Perovetz Lawrence M.
Pickthall Jack
Lamerie N.v.
Malcolm Johnston & Associates
Perovetz Lawrence M.
Pickthall Jack
Pickthall Terence
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