Solutions for chemically polishing surfaces of copper and...

Details Solutions for chemically polishing surfaces of copper and... Solutions for chemically polishing surfaces of copper and...

C - Chemistry, Metallurgy

11

D

149/14, 149/26,

C11D 7/26 (2006.01) C11D 7/18 (2006.01) C23F 3/06 (2006.01)

Patent

CA 1052674

Abstract of the Disclosure SOLUTIONS FOR CHEMICALLY POLISHING SURFACES OF COPPER AND ITS ALLOYS A solution for chemically polishing surfaces of copper and its alloys contains acid oxalates at a pH value of 3.0 - 5.0 in combination with hydrogen peroxide and one or more stabilizers and brighteners. - 1 -

241155

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