C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 7/00 (2006.01)
Patent
CA 2445732
The invention relates to the use of an aromatic-free mixture of solvents which contains or consists of: (A) at least one low-boiling organic solvent and (B) at least one organic solvent selected from the groups comprising high-boiling and medium-boiling organic solvents, where (1) at least one of the organic solvents (A) and/or (B) has a Hildebrand Solubility Parameter d (HSP) between 10.5 and 12.0 (cal/cm3) and a Hydrogen Bonding Index (HBI) between -15 and - 20; and (2) at least one of the organic solvents (A) and/or (B) has a Hildebrand Solubility Parameter d (HSP) between 8 and 9.7 (cal/cm3) and a Hydrogen Bonding Index (HBI) between 0 and 12. The property profile of mixtures containing solvents which are cured physically, thermally and/or using actinic radiation, and products produced therefrom is improved by the above. The invention also relates to a mixture which can be cured physically or thermally and/or by means of actinic radiation and which contains said aromatic-free solvent mixture.
L'invention concerne l'utilisation d'un mélange de solvants, exempt d'aromatiques, pour améliorer le profil de caractéristiques de mélanges renfermant des solvants, durcissables par voie physique ou thermique et/ou par exposition à un rayonnement actinique, et de produits obtenus à partir de ces mélanges. Ce mélange de solvants contient ou est constitué des composants suivants : (A) au moins un solvant organique à faible point d'ébullition ; (B) au moins un solvant organique sélectionné dans le groupe comprenant les solvants organiques à haut point d'ébullition et à point d'ébullition moyen. Selon l'invention, (1) au moins un des solvants organiques (A) et/ou (B) présente un paramètre de solubilité de Hildebrand .delta.(HSP) compris entre 10,5 et 12,0 (cal/cm?3¿)?1/2¿ et un indice de liaison hydrogène (HBI) compris entre -15 et 20 ; et (2) au moins un des solvants organiques (A) et/ou (B) présente un paramètre de solubilité de Hildebrand .delta.(HSP) compris entre 8 et 9,7 (cal/cm?3¿)?1/2¿ et un indice de liaison hydrogène (HBI) compris entre 0 et 12. L'invention concerne également un mélange durcissable par voie physique ou thermique et/ou par exposition à un rayonnement actinique, contenant ledit mélange de solvants exempt d'aromatiques.
Baumgart Hubert
Kleine Beckmann Helmut
Mayenfels Peter
Pyttlik Andreas
Basf Coatings Ag
Robic
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