C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/40 (2006.01) B32B 15/08 (2006.01) B32B 15/20 (2006.01) B32B 17/04 (2006.01) C08G 59/06 (2006.01) C08G 59/68 (2006.01) C08K 5/09 (2006.01)
Patent
CA 2151834
Epoxy resin compositions used in preparation of laminates for electronic applications are free of the solvents typically needed in current industrial practice. The use of certain mono-substituted dicyandiamides makes possible the elimination of such solvents since all of the components are soluble in epoxy resin to an extent which provides uniform properties in the cured laminates.
Conrad Jeffrey Paul
Konicek Jiri Daniel
Tungare Aroon Vishwanath
Zupancic Joseph James
Alliedsignal Inc.
Gowling Lafleur Henderson Llp
LandOfFree
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