Solvent-free floor covering adhesive and method of producing...

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 191/00 (2006.01) C09J 123/02 (2006.01) C09J 125/10 (2006.01) C09J 193/00 (2006.01)

Patent

CA 2098204

A solvent-free adhesive formulation and a method for producing the adhesive is disclosed, the method involving dissolving resin in a heated oil and adding a surfactant thereto for dispersion purposes. Water is added to the resultant mixture to form an emulsion. A caustic agent is added to stabilize the emulsion and latex and thickener are added to the emulsion at ambient temperature. A stable, solvent-free adhesive is produced having superior bond strength and aging characteristics.

Formulation d'un adhésif sans solvant et méthode de production; la méthode comprenant la dissolution de résine dans une huile chauffée et l'ajout d'un surfactant à des fins de dispersion. On ajoute de l'eau au mélange obtenu pour former une émulsion. On ajoute un agent caustique pour stabiliser l'émulsion et on ajoute du latex et un agent épaississant à l'émulsion, à la température ambiante. On produit ainsi un adhésif stable et sans solvant doté de caractéristiques de résistance d'adhésion et de vieillissement supérieures.

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