Solvent-free, low-monomer or monomer-free polymerizable hot...

C - Chemistry – Metallurgy – 09 – D

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C09D 167/04 (2006.01) C08F 290/08 (2006.01) C08F 299/04 (2006.01) C08L 67/04 (2006.01) C09D 157/00 (2006.01) C09D 157/10 (2006.01) C09D 167/00 (2006.01) C09D 201/06 (2006.01)

Patent

CA 1325688

ABSTRACT There are described solvent-free, low monomer or monomer-free polymerisable melt compositions suitable for the corrosion and abrasion resistant coatings of substrates and formed bodies of metal, plastic, cellulose materials and/or inorganic materials and/or the creation of a protective film with barrier properties and methods of making them. The melt compositions are particularly useful especially for use in packaging, and comprise: a) at least one polymerisable, hydroxyl-containing polymer having an average molecular weight (?w) of between 1,000 and 500,000 and a glass transition temperature (Tg) of ?+20° C, and/or b) at least one polymerisable, linear unbranched and/or branched polyester and/or its copolymer having an average molecular weight (?w) of between 800 and 50,000 and a glass transition temperature (Tg) of ?-50° C, and/or c) a polymerisable oligomer carrying an ethylenically unsaturated group, of the following group consisting of acrylic, methacrylic, ether, ester, urethane, amide, imide, epoxide, siloxane, phenol, novolak and/or mercapto compounds having an average molecular weight (?w) of between 400 and 10,000, and d) if required, conventional additives. Further described are processes for preparing these melt compositions and methods of further processing these melt compositions and finishing planar substrates and/or shaped bodies with these melt compositions. Moreover, the present invention relates to a process for polymerization or curing of the melt composition.

553477

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