C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 77/14 (2006.01) C08K 5/00 (2006.01) C08K 5/55 (2006.01) C08L 83/04 (2006.01) C09D 183/04 (2006.01) C09J 7/04 (2006.01) C09J 183/06 (2006.01)
Patent
CA 2107715
SOLVENT-FREE ORGANOSILOXANE COMPOSITION AND ITS USE Abstract of the Disclosure A solvent-free ternary organosiloxane composition is disclosed, which contains (A) liquid organopolysiloxane, (B) a cross-linking agent, and (C) a curing catalyst and, optionally, (D) a filler, said organopolysiloxane (A) being constituted by organosilicon group of X-Si (wherein X represents a hydrogen atom or a monovalent hydrocarbyl group) and functional side chain of OR (wherein R represents a hydrogen atom, a C1 - C5 alkyl group or an acyl group), said cross-linking agent (B) being one or more organometallic compounds selected from the group consisting of an organoaluminum compound, an organoboron compound, an organosilicon compound, an organotitanium compound and an organozirconium compound having at least one functional group selected from the group consisting of an alkoxy group, an acyloxy group and an oxime group, and said curing catalyst (C) being a metal-containing organic compound, with the total contents of the metal elements of the ternary composition being 25 % by weight to less than 40 % by weight in terms of MOy/2 (wherein M represents aluminum, boron, silicon, titanium or zirconium, and y represents a valency of the metal element). A shaped polymer composition, an adhesive polymer composition, a composite structure, a composite sheet and a building material using same are also disclosed.
Naito Shizu
Robic
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