Solvent free process for making uv curable adhesives and...

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 163/08 (2006.01) C08J 3/28 (2006.01) C08L 63/08 (2006.01) C09J 115/00 (2006.01) C09J 153/00 (2006.01)

Patent

CA 2224636

The invention herein is a solvent free process for producing UV curable adhesive and sealant compositions comprising a monool, tackifying resin, and a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation and wherein the polymer contains from 0.1 to 7.0 milliequivalents of epoxy per gram of polymer. The process involves predispersing an insoluble photoinitiator in a component of the formulation with which it is more compatible than with the tackifying resin, and then adding the tackifying resin to the predispersion.

La présente invention se rapporte à un procédé sans solvant pour fabriquer des compositions d'adhésif et de joint étanche durcissables aux U.V., comportant un monool, une résine collante et un polymère de polydiène époxydé monohydroxylé comprenant au moins deux monomères d'hydrocarbure polymérisables éthéniquement insaturés, dont au moins l'un d'entre eux est un monomère diène qui produit une insaturation convenant à une époxydation et où le polymère contient entre 0,1 et 7,0 milli-équivalents d'époxy par gramme de polymère. Le procédé consiste à prédisperser un photoinitiateur insoluble dans un composant de la composition avec lequel il est plus compatible qu'avec la résine collante, et en ajoutant ensuite la résine collante à la prédispersion.

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