Solvent-free, radiation-curable primer

C - Chemistry – Metallurgy – 09 – D

Patent

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Details

C09D 5/00 (2006.01) B32B 27/08 (2006.01) C08G 59/24 (2006.01) C08J 7/04 (2006.01) C09D 163/00 (2006.01) C09D 175/00 (2006.01) C09J 5/02 (2006.01) G03F 7/004 (2006.01)

Patent

CA 2268622

Solventless and waterless primers which are hardenable by radiation, based on hydroxyfunctional prepolymers and cycloaliphatic epoxides, or based on hydroxyfunctional prepolymers and olefinically unsaturated compounds, or based on epoxides and vinyl ethers and cationic or radical initiators, can be applied like usual commercial solventless covering adhesives and permit subsequent in-line coating when there are many coatings, without solvent and/or water having to be volatilized from the primer coating.

Des apprêts durcissables par rayonnement, exempts de solvant et anhydres, à base de prépolymères hydroxyfonctionnels et d'époxydes cycloaliphatiques ou à base de prépolymères hydroxyfonctionnels et de composés oléfiniquement insaturés, ou encore, à base d'époxydes et d'éthers vinyliques et renfermant des initiateurs cationiques ou radicalaires, peuvent être appliqués comme des adhésifs de couverture, exempts de solvant, de type courant et permettent d'effectuer, en cas de revêtements multiples, un revêtement subséquent en continu, sans qu'il soit nécessaire de faire évaporer le solvant ou l'eau à partir du revêtement d'apprêt.

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