Solvent-modified resin compositions and methods of use thereof

Details Solvent-modified resin compositions and methods of use thereof Solvent-modified resin compositions and methods of use thereof

H - Electricity

01

L

H01L 23/29 (2006.01) C01B 33/14 (2006.01) C08L 63/00 (2006.01)

Patent

CA 2537827

A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

L'invention concerne une composition de résine modifiée par solvant destinée à être utilisée comme matière de sous-remplissage. Cette composition contient au moins une résine époxy, au moins un solvant et un agent de remplissage d'une silice colloïdale fonctionnalisée. La composition de résine modifiée par solvant permet de rendre transparents des films résine d'étape B. Des modes de réalisation de l'invention comportent l'utilisation comme matière de sous-remplissage au niveau plaquette, et comme agent d'encapsulage pour les puces électroniques.

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