C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 5/00 (2006.01) C08G 59/18 (2006.01) C08G 59/40 (2006.01) C08K 5/07 (2006.01) C08L 63/00 (2006.01)
Patent
CA 2128824
ABSTRACT 1. A water-free solvent system containing methoxy acetone and an organic protic solvent is useful as a solvent for a) a curing agent for an epoxy resin, such as a dicyandiamide and/or b) a curing catalyst and/or c) a cure inhibitor.
Everett John Peter
Zwinselman Jan Johan
Smart & Biggar
The Dow Chemical Company
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