Solventless compounding and coating of non-thermoplastic...

Details Solventless compounding and coating of non-thermoplastic... Solventless compounding and coating of non-thermoplastic...

C - Chemistry, Metallurgy

08

J

C08J 3/20 (2006.01) B29B 7/48 (2006.01) B29B 13/08 (2006.01) B29C 47/02 (2006.01) B29C 47/06 (2006.01) B29C 47/10 (2006.01) C08J 3/18 (2006.01) C09J 5/08 (2006.01) C09J 7/02 (2006.01) B29C 47/40 (2006.01) B29C 47/50 (2006.01) B29C 71/02 (2006.01) C08L 21/00 (2006.01)

Patent

CA 2147507

A solvent-free hot melt process, for preparing a non-thermosettable, pressure- sensitive adhesive from a tackified non- thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying zones (1, 3, 5, 7, 9 and 11) and processing zones (2, 4, 6, 8 and 10). The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

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