Solventless forming method for heat exchanger panels

F - Mech Eng,Light,Heat,Weapons – 28 – F

Patent

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F28F 21/06 (2006.01) B29C 49/00 (2006.01) B29C 51/00 (2006.01) B29C 69/00 (2006.01) B32B 27/34 (2006.01)

Patent

CA 2294866

A method for forming thermoplastic heat exchanger panels without using solvents, wherein a co-extruded film is used to provide a layer of toughened, heat-sealable nylon on a layer of regular nylon, and using such panels in a gas-assisted press bonding process to form the heat exchanger panels.

Selon un procédé permettant de former des panneaux thermoplastiques d'échangeur thermique sans utiliser de solvants, on utilise une feuille co-extrudée pour constituer une couche de nylon thermoscellable renforcé sur une couche de nylon ordinaire, puis on applique auxdits panneaux une technique pneumatique de liaison par presse, de façon à former les panneaux d'échangeur thermique.

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