Solventless or high solids-containing silicone pressure...

Details Solventless or high solids-containing silicone pressure... Solventless or high solids-containing silicone pressure...

C - Chemistry, Metallurgy

08

L

C08L 83/07 (2006.01) C09J 7/04 (2006.01) C09J 183/04 (2006.01)

Patent

CA 2061972

Docket No.: 60SI-1406 Solventless or low solvent-containing silicone pressure sensitive adhesive compositions having excellent adhesive strength and high tack are provided, comprising (A) a toluene-soluble resinous copolymer containing R3SiO1/2 units and SiO4/2 units; (B) a vinyl-endblocked polydiorganosiloxane having a viscosity of 10 to 500 centipoise at 25°C.; (C) a hydride-endblocked polydiorganosiloxane having a viscosity of 10 to 1000 centipoise at 25°C.; the ratio of silicon-bondod hydrogen atoms in (C) to olefinically unsaturated radicals in the total of (A) and (B), being in the range of from about 1.2:1 to about 15.0:1; and (D) a hydrosilation catalyst.

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