Solventless or high solids-containing silicone pressure...

Details Solventless or high solids-containing silicone pressure... Solventless or high solids-containing silicone pressure...

C - Chemistry, Metallurgy

08

L

C08L 83/07 (2006.01) C09J 7/04 (2006.01) C09J 183/04 (2006.01)

Patent

CA 2061973

Docket No.: 60SI-1455 Abstract of the Disclosure Solventless and high solids-containing silicone pressure sensitive adhesive compositions having high peel adhesion and high tack are provided, comprising (A) a toluene-soluble resinous copolymer containing R3SiO1/2 units and SiO4/2 units; (B) a vinyl-terminated polydiorganosiloxane; (C) a hydrogen- terminated polydiorganosiloxane; (D) a hydrosilation catalyst; and (E) from 0 toabout 10 percent by weight of an organic solvent; provided that the combined viscosity of (B) and (C) is from about 10 to about 500 centipoises at 25°C., the combined crosslink densities of (B) and (C) is from about 0.3 to about 5.0 %, preferably 0.3 to about 2.0%, and the molar ratio of silicon-bonded hydrogen groups in (C) to silicon-bonded alkenyl groups in (B) is in the range of from about 0.8:1 to about 1.5:1 and preferably about 1:1.

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