H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/60 (2006.01) H01L 23/62 (2006.01) H01T 4/08 (2006.01)
Patent
CA 2262043
A method and assembly for a spark gap. A plurality of resistors are positioned adjacent the spark gap for reducing the energy in the gap during electrostatic discharge.
Marks & Clerk
Mitel Corporation
LandOfFree
Spark gap for hermetically packaged integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Spark gap for hermetically packaged integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Spark gap for hermetically packaged integrated circuits will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1353037